iPhone 7 rear panel shows large camera bump, source insists 3.5mm jack present
A single photo of an alleged back panel for the 4.7-inch future iPhone, posted on Weibo, fails to provide evidence. However, the source is the same user that leaked photos of components before, revealing the said jack. A Wall Street Journal publication from this week said the jack would be gone, citing unnamed insiders.
Anyway, the back panel in the photo carries a design already familiar from the multitude of leaks. The relocated antenna bands are apparently final and so is the bulkier camera module. The source postulates that a larger CMOS sensor is to blame.
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