iPhone 7 rear panel shows large camera bump, source insists 3.5mm jack present

Speculation continues on the controversial subject of the next iPhone's 3.5mm headphone jack, or rather the rumored lack thereof. In today's episode, a source out of China states that the decades-old analog connector will remain a feature of the iPhone7
A single photo of an alleged back panel for the 4.7-inch future iPhone, posted on Weibo, fails to provide evidence. However, the source is the same user that leaked photos of components before, revealing the said jack. A Wall Street Journal publication from this week said the jack would be gone, citing unnamed insiders.
Allege iPhone 7 rear panel (click for full-size image)
Allege iPhone 7 rear panel (click for full-size image)
Anyway, the back panel in the photo carries a design already familiar from the multitude of leaks. The relocated antenna bands are apparently final and so is the bulkier camera module. The source postulates that a larger CMOS sensor is to blame.
Source | Via

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